@technician

t@technician 27 August 2021

Full loaded friday People said TGIF, but here is diffferent, all are loaded heavily. Show you list of issues: PROBER RELATED ISSUE FOLLOW UP: 1) TREB14 - DOWN MAINT - Handler recovery error ON & OFF for 2BO thin wafer - trouble shoot by prober tech , pls follow up. PROBE CARD ISSUE FOLLOW UP: 1) Probe Cards are P.V Rack after repaired and wash/check due to fail. Please push these probe cards for production and confirm status. MRT06031 - COMMAN MRT05119 - 6A MRT11094 - GD50BE MRT10133 - GD50BE MRT10172 - GD50BE DAILY AVP Prober/Tester Issue Update: 1) TREB07 :Timer1 failure. Change EIM board 9104 but cannot download. Origin is 9102. Will need to confirm with 9102 to move forward. 2) TREB23, TREB17 and TREB27 prober marks out of pad on first check ( Prober Tech. Today had down B23 for Tham to check, will continue to check tomorrow... 3) TREB10 - Handler recovery at Prealigned error frequently happened - attended by prober tech for few times - Pls monitor. Action taken: swap epprom and burn in no issue but after rtp prob happen again after few lot. QUAL TASK RELATED ISSUE: 1) Pls take note : GPC ( Res test ) ---> Awaiting for Andrew SRU CAL head back from Tektronix. VERIFIED faulty PAA cards and pending for level 2 decision. 2) Pls take note : GPC ( Res test ) fail on V_1Vse00nA4mV_4w847 for : - TREB04 - TREB18 - TREB26 - TREB17 - TREB14 3) Pls take note - GPC ( cap test ) fail on channel 33,34 on TKB09. 4) Plse take note - B07 HV meter had shifted to B09 by SEE on 150816. TESTER DELINK STATUS: 1) TREB11 --> Test issue Delink 3H device. 2) TREC17 --> Jen delink 2C on 3) TREC16 --> delinked 2D BY Jennifer on 300616,RSPp 4) TREB13 --> 5U delinked temporarily due to suspect tester issue by j.zhi on 230816. 5) TREC25 --> 6A 3um has qualified and QVlinked on TREC25 by j.zhi For new p/file creation on TREC25, please turn on Online Cleaning option for 6A new p/files.

t@technician 26 August 2021

Relocation filled my day today Relocation project progress as below : R11923 Sx reallocation during PM today. To refer to check list for tool qualification (refer to Oh emails in details). Already printed out hard copy of qualification check list . Pls follow accordingly Test run with 20mins ( SX set as 5,10, 15) to cover GR from 0.869 to 1.548 m/min. R11923B test run with 20mins ( SX set as 5,10, 15) to cover GR from 0.850 to 1.494 m/min. Updated Etcher and treatment recipe for both side and arranged 2x1731 to target 1.45 GR using the SX setting from the graph. Updated result to team. Pls follow up 2x1731 TR result A side reduce Sx from 14g - 13.5g , GR= 1.48 ( expected to achieve ~1.43 from calculation BUT GR no response). B side reduce 14.5g to 14g, GR=1.453 ( GR drop from 1.48 to 1.453 – GR responding ) Redo test run GR stability on A side, if stable, can proceed F/L+SRP wait for result. If still not stable, to redo test run again to monitor growth rate stability. Follow up Intrinsic and SPV one side B side SRP pass. Both side release prod as per Alex approval. A side do test run with Sx 14 ) Recipe: wwePMOSLTO_01_ENG) to verify GR vs run before using check GR result As per Alexe redo TR check GR is 1.513 with source setting 14g and Conclude: - 1>Repeatedly test confirmed GR is stable. - 2>Discussed with Alex we suspect 1st TR with SX 14g high light in red one wrongly - As per discussed with Toh every run measure thickness to monitor GR stability - Operator found R918B side quartz holder with white powder. - Check bell jar found rainbow colour also. - Stop for maintenance do leak test and found leak from flexible hose. - As per discussed with maintenance stop wash bell jar and quartz items - Check B side last 2xruns AVI passed. - Check A side last 2xruns AVI passeD. - Checked B side last run under scope and collimated light no wafer haze found. - The last run hold back for Wong and Alex validate and confirm the quality.

t@technician 26 August 2021

Engineering work for problematic production lots Today have to continue to sweep the dust Engineering work for problematic production lots: XX40 OOS lot disposition need full lot measurement. Many of you may know XX40 OOS lot disposition need 100% measurement. If any lot encounter OOS for CD and thickness, pls sort wafers and do all 25 wafers measurement before move lot to next level. We may have more OOS due to contact ROX bring down. I need team help to do 100% measurement if ROX after metal etch showed OOS. After re-measure, please send am email to Thomes. Pls adjust step to remeasure good wafer before move out the lot. Pls hold at next step for PO to dispose the lot. (no max delay operation) 8" BCD6: Residue Issue at EM layer (LOT # START WITH "C"). AITX will hold the lot if residue counts>30 and etching will manual rework. If residue <50 counts, lot can move as per normal. If failed, pls rework lot with BKMPOLYMER in ETGP8xx. Latest info, don't hold back under 230 after rework, keep on hold 214RWK PAM801/802 alarms that fail for black mapping at EM2 scan. As per PO, in future if will encounter the same issue (wafer stayed in chm for a long time) or any alarm and affected wafer failed for black mapping, ok to scrap immediately and inform her. If failed cluster of particles, adv hold for PO to dispose at EDIFH / EDPASS. IF ENCOUNTER ANY HE BACKSIDE ISSUE PROBLEM DESCRIPTION NEED TO INCLUDING: 1. HOW MANY LOT IMPACTED 2. HOW MANY TOOL IMPACTED 3. HOW MANY WAFER IMPACTED 4. DEVELOPER STAIN ISSUE AND NEED TO FEEDBACK TO PROD ENGR. For 8V lots incoming for this prdt CL283AA6-6 (hold for PO), pls execute:- - Sort to LM# before PROC - Proc ONLY 1 lot in AAE06/4/7 no buddy lots allowed. Procedure for AJTANA lot process in ASLM851: PLs season the chamber with QRENA recipe. Process the lots and delinked recipe after. Pls do 10 wafers std seasoning and SS check before run std

t@technician 25 August 2021

Deep shit in machine and temporary solution The machine 01 is running into problem, so me and teammate came out a temporary solution to contain the problem. 1. Mask contact level need to run with batch by poly cells.Do sample when change batch. Zcell05 and Zcell18 one batch. Zcell20, ZCELL21 one batch Zcell22 one batch. 2. Zcell22: Ban Gen-3 metal due to CD unstable 3. Zcell18: Ban Tanis poly due to Bin8,9 loss, pending further investigation. 4. Zcell23: Coater unit 3 motor faulty, no spare part, June took the motor from developer unit 3, so by passed developer unit 3 for pg#11,12,14,15 5. ZCELL03: Developer PG#2 B/S stain unable to resolve, QV delinked 6. Zcell22: Ban dev unit 5 due blue cd variation issue. traced back issue from 8-Feb due to poly cd unstable. 7. ZCELL07: TANIS SLOPE TRM BANNED due to frequent Misalignment 8. ZCELL13: AWW SLOPE BAN DUE TO EWS BIN4 ISSUE SLOPE BANNED DUE TO EWS ISSUE, CONCERN ON EBR DRIP 9. KLSC15: TEMPORARY DELINK PRMCT-MPG2 DUE TO MS6SSMT2-1 NOT LINK TO KLMSC15 10. KLSC21: SOFTBAKE HPO UNIT 10 SUPPORT PIN BROKEN, NOE FIXED, BYPASS HPO UNIT FOR PG$21,22,24,25. 11. KLSC01: TEMPORARY BY PASS UNIT 4 DUE TO DROP WAFER AFT COATING DUE TO ROBOT ARM ISSUE -KLSC01 unit#4 not activated for pg#2 due to mismatch in spin speed between the unit#3 and #4. Coat pg#6 the unit#4 already activated. 12. ZCELL04: Pre-aligner issue. Delink for all first mask except 2W9 adaptor & 3Q9 adaptor 1st mask as these are single tool. 7A9 Mask base also not delink as some 7a base is not first mask If the problem persist, Previously avi ooc due to LM02 stacking faults. Epi engr request 100% avi result and informed avi operator to proceed eos.Pls feedback to epi engr once scan done

t@technician 24 August 2021

Busy work here and there To confirm RS no drift. Today we did many stuffs: <In all Auto-switch event onwards, to arrange the measurement for the GBT RS measurement that the run is processed 3hrs AFTER A/S and 6S9 RS measurement that the run is processed 6hrs AFTER A/S.> E.g. 8am A/S happened, measure the IGBT run processed at ~~11am and 6S9 run processed at~~ 2pm. Not sure, pls verify with Nani. PROCESS Alignment: 1. For all loading issue, add the loading op ID here to track. Willaim will compile and share with PROD team. OOC due to Loading Issue: 2. For incoming issue, need to alert to previous module / relevant stakeholders officially by email communication. 3. Do not use Profiler Coil for THK tuning and Do not use H2M for RES tuning. 4. For the qual results, need to be shared thru passdown OR email as official communication, not saved in common drive only. 5. For Back Transfer process, pls be reminded that the BT THK / DW qual is only refer to F/L result. Test run result is not being considered <as per DPQ system, we still need to key TR result> and team is working on APF system to replace DPQ system. NEW 6. For the intermittent loading issue, pls investigate the blackbox for the lift down timing, life up timing and standby timing. Also, to check if the operator did the wafer flat alignment at loading station OR at the workstation, any PM activity for tool beside and etc. We will work out the package process checklist for intermittent AVI OOC <based on fishbone analysis input>. 7. With immediate effect to stop any MFC Zeroing due to recent Res OOS case in R919. PROCESS ISSUES: TC16K SUS 23/07 G1 Night XL - So far TC16KXXXX RS issue rate 50%. - As per Wourng we increased RS sampling from 1 sample/ day to 1 sample/shift for TC16wwwXXXX susceptor. - Instructed above information to EGA GUI and informed production.

t@technician 23 August 2021

Monday blue with 3 issues Today Monday blue , and I have 3 main issues to attend: Issue 1: Please send the remaining CIV913 EWS Rework wafers to do the following rework: 1. BTRECYLE.->Done. 2. Send for Irradiation using Irradiation dosage 18.0KGY-> Done assign 18KGY. 3. Written on runsheet to hold before Annealing to perform measure initial Tx and sample Anneal 2pcs for 10mins at 350degC. 4. Measure 2nd Tx and EWS HFE condition. HFE@500mA/5V,spec:36.5-63.5; HFE@10mA/5V,spec:>26.5; HFE@2A/3V,spec:20-33. 5. Proceed to Anneal above lot condition meet for the 2 pcs sample anneal. Issue 2: OP2321 accidentally unload 50wfrs into 1 carrier due to forgot to chk unloading mode of JDMG01 after TM6L1B Anneal PSG. The mode was at 25wfrs during the unloading. Informed G3 surpervisor Markon. Done 100% AVI scan at Etch Contact.As per Ande, WML530730/DKL530923 moved out and done adv hold at Passivation to do 100% Tencor and MRB. - Lot 1 done 100% tencor at PASSIVATION. Lot moved. - Lot 2 done 100% tencor at PASSIVATION. Please inform operator to review wfr of hightest tencor cts. Hold for MRB (hold under 211RW, Operator unloading issue at Anneal PSG, to attend MRB). Pending tencor review LM25. Issue 3: defectivity < 50cts, to inkoff @ etch poly, no need to do rework, email ishairi and Andrew the lot id/wfr wfr id . For all poly rework pls perform 100% tencor scan at BARE-SI, GOX and POLY . Use ONLY fresh TW for CV/SPV. Do not send for reycle after use For C23V163 adv hold for sample Tx, please consult Iseri on disposition. Do not hold lots due to no recipe linkage, to escalate to perform linkage. If any of main lots with WIT1 HFE low done additional measurement, pls key into rediff route first,can ask Gao Wei's help to decide on rediff timing

t@technician 20 August 2021

Tiring friday Yet another tiring day , here I share what I and team did in the day LP01 (1900 ~ 2050) Mthly PM follow up by Goh. Run 1 lot of conditioning done. Qual,E/r check passed 5377, del 01.75 % . PAR:11/ & 12/1 counts. Performed 5S done.Point check. & Tencor check by Engineer pass. LA1B (2100 ~ 0615) It was Down For Max run + SFG s/h change PM Done by Goh. Process chamber wet clean done. Scrub process chamber with green wool. Upper and lower baffles wet clean done. Replaced s/h inner and outer o-ring. Replaced all screws and inserter & SFG silicon electrode. Replaced all ceramic parts Gap Parallelism check done. Replaced endpoint o-ring. Replaced helium clamp and vespel ring. Closed and pump down chamber & done. Check all parameter done. Gap cal, no adjusted. Quals: # L/r :5.00 mt/min # E/r :4523,4429,4500,4539,4530=4504 Delta :110 # Par :10/1 counts Performed 5'S done & M/C up for prod.

t@technician 18 August 2021

All Stations Target Change step by step Quantum Source (PCW) Purging Procedure. (All Stations Target Change) Below is the diagram of whole machine: **First,** Disconnect motor power connector for all stations. Disconnect drain line from pressure relief quick release fitting and connect to drain quick release fitting for all stations. Secondly, Open drain ball valve & Install purge hose assembly. Ensure purge manual valve is closed. Thirdly, Turn off PCW Supply ball valve. Also Turn off PCW Return ball valve. Most importantly, Open purge manual valve slowly. Ensure PCW supply pressure is not more than 35 psi. Purge at least 5 mins. Last but not least , Close purge manual valve. Quantum source purging is now complete. Job done and proceed with PM. Load and run recipe. Under “Wip” menu select “Start” to change system state to CAP (Continuous Automatic Processing) mode. Need to press ‘Schedule WIP” menu and select recipe you want to run ie “Null process”. Press “Load/Unload” and determine the wafer slots number you wish to run. Wait for the system to prompt you to load the metal cassette. Open load door and load the metal cassette then close load door . System will automatically process the wafer. Wait the system to prompt you to unload the processed wafer and press “Unload” Metal cassette will go to unload door. Open unload door and remove metal cassette. The system will automatically proceed to standby mode.

t@technician 17 August 2021

Leak check Today I wanna share a skill that we technician need to master- **Load Lock Hi-vac Leak Check.** Firstly, Pump down chamber to base pressure. <2.0 x 10e-6 Torr. (Under “Equipment Operations” menu. Select “Wafer Movement” and press “Rotate one” press “Yes” to confirm.) **Secondly s**elect “Vacuum Map” and close Load Lock Cryo Hi-Vac valve and L/L Diff Pump valve.(Open “N2 Vent Valve”. chamber pressure must be <3.0x10e-6 in 1 min. Change Load Lock Hi-Vac valve if pressure requirement is failed.) **Thirdly,** under “Maintenance” menu select “Park System” and press “Park” to confirm. Load Lock Double O-ring Leak Check. Make sure Load Lock Cryo Hi-Vac valve leak check test is passed. Following, Pump down chamber to base pressure <2.0 x 10e-6 Torr. (Under “Equipment Operations” Menu. Select “Wafer Movement” and press “Rotate one” press “Yes” to confirm.) Select “Vacuum Map” and close Load Lock Cryo Hi-Vac valve. Open “N2 Vent Valve”. Chamber pressure must be <5.0x10e-6 in 1 min. Open chamber and change Load Lock double o-ring if pressure requirement is failed. (Under “Maintenance” menu select “Park System” and press “Park” to confirm)

t@technician 17 August 2021

Problematic day with many issues Machine 52 is having error 60,found loose nut on cylinder.So Adjust cylinder stroke and tigthen nut. dummy run,ok Machine is having 04-etchrate and uniformity fail. Have checked acutal RF with bird meter from PVD rf within specs at 207watts. found heater lamp halogen bulb blown. replaced and tested ok. Machine 05 haivng -handling error. Due to left swivel vacuum drop and right fork place position sensor holder loose.We replaced pinched vacuum tubing caused by bent vacuum pad as left fork hitting during transfer.. Adjusted rest position angle as its to0 high from 17 to 15.He resecured sensor holder on right fork side, ran cycle test ok.. handover to engr. Machine 57 having surfscan issue. Have run test wafer reading is 325,98 small big respectively. Had purge n2 while cleaning the chuck. Run test wafer 44,13 reading. Next adjust swivel loading and unload parameter. Test run using test wafer passed 2x. Also run 1st surfscan wafer passed. Please continue to run, need to pass 3 times due to ss hold and need to run oxide wafer for seapaged verification...

t@technician 17 August 2021

Unscheduled events We have a lot of cases that the profiling always turn black(the plate attached to it). Temporary action: 1. No Maint is allowed to touch the profiling coil setting. 2. Only Alan is allowed to do this changes. Visual check on EPR06 & EPR11 Profiling Coil Condition ------------------------------------------------------ Do view attcahed pictures BELL B ALARM (Yesterday Issue) - if there's re-occurance, kindly replace the +15mBar Pressure Switch Meeting Highlights ------------------- 1. Was AS15 Left LL checked? Need to Rt>Lb ? (ASM arm) -ok 2. AS42 Top wafer drag-out. Need to Rt>Lb ? (ASM arm) -ok 3. R09B need to check Bell B Alarm Pressure Switch -not done- (Remind in passdown to change pressure switch if re-occurance) 4. Check R11 Profiler Coil Condition -ok- (No one except Alan authorized to make physical changes) 5. Thurs: AS801 & AS22 Arm Change -ok- Had regen the all cryos. & Remove the source side,and clean the source housing. Install bak al the new parts from rebuild.Put same source after rebuild. Remove the beam guide and graphite.The graphite send to rebuild to sant blast. Only Scrub AMU housing bottom side. Please follow up scrub the AMU housing top side.

t@technician 16 August 2021

SF issue for machine Today we had this problem, so SF issue (suspect substrate issue) follow up passdown are as below: Need to do surf scan for wafers placed on F3X1 rack at 01:15 AM and share results with XL to compile report. All result with increasing trend especially for slot 01# but the defects count still within SPEC.Pls continue monitor one more time end of night shift. Tomorrow we will review the result and decide whether still need to monitor or not As per discussed with Wong we will stop the SS check as defects trend keep increasing after facility resolved ceiling issue. Team will decide whether can release the rack to production or not as dust count still fail verified by EPI PE Latest SS done @ 18/Jul 01:15 AM For sure the defects average with increasing trend.Final defects count average is 18 from 30/Jun 01:15 pm until 18/Jul 01:15 am totally 420 HRS. To discuss with team whether acceptable or still need to collect the data further.

t@technician 16 August 2021

Equipment Issue during shift -HV standby error/HV range error during 4 layers process. -Error during Cr initial ramping power, wafers in chamber. -Checked HV triode tube glowing. -Checked plug-in PCB U2, U3 and U5 power supply board. -contact cleaned U2 and U3 PCB. -Measured +-15Vdc and 24Vdc from ext PS ok. -Tested HV standby ok but HV range error persisted -Coil current ok. reset EEC300 controller -ve. -Disconnected HV from red box to isolate chamber -ve. To continue. -----------------------------------G2------------------------------------ -PO said wafer cannot wait more than 24hours. -so vent chamber and take out wafer(NCL) -Dayshift no MS support,kindly to continue. ----------------------------------G1------------------------------------- -After vented chamber, checked/measured Egun shorted to gnd. -Found flake from chamber shields shorted Egun, cleaned up and tested -ve. -Probably flake shorted Egun after vented chamber. -Removed U4 grid ctrl board, power transistor IXTM10N100 and measured no shorted. -Measured U4 board, TP2=8.4V, TP3=86V, TP4=95V at HV off state ok. -Measured grid voltage -583V at U13 ok. -checked soldering points on board and installed back, tested HV 10KV ok. -Tested HV on/off few times, encountered HV range error intermittently. to continue. Status : Maint

t@technician 8 August 2021

Singapore National day Tomorrow is 9 Aug and will be Singapore 56th birthday ! So tomorrow will be a public holiday, linking with this weekend forming the long weekend ! Apart from this good news of having long weekend, another good news brought by the Singapore Government was to open dine-in for 2 person at food court and restaurant! there are more relaxing rule for those fully vaccinated but for me , the uplift ban of dine-in already a super good news for me as I can enjoy my lunch at nearby canteen and food court. So this tuesday even though have to work after long rest , but I look forward for the day lunch time to come as I wanna patron the favourite hot fish soup noodle nearby! Hopefully tue lunch hour not rain! I wanna go visit after a long period of dine in ban !

t@technician 29 May 2021

t@technician 26 February 2021

世界有趣的中文Youtubers 世界这么大，不同种族会有不同的习惯爱好，而如果不同种族在推广自己的文化视频的当儿，能够以中文面向观众，让非英语系的朋友能在不透过英语的情况下，更加了解彼此。我自己看了许多文化有关的视频，在此列表跟大家分享，如果大家也有值得介绍的YouTuber，记得留言给我去看看。世界有趣的Youtubers：内蒙古族：《多多其木格》 https://www.youtube.com/channel/UCnR1ijy75_rjnUwzAir9l1w 新疆维吾尔族: 《**安妮古丽**》 https://www.youtube.com/channel/UCRc63ZkXuzAWGzaJVEe_hxA https://www.youtube.com/channel/UCRc63ZkXuzAWGzaJVEe_hxA 新疆塔吉克族：哈尼克斯 Xinjiang Girl https://www.youtube.com/channel/UCeOY65D9EfVJtlfEQpZ1KWg/videos 伊朗：《波斯秘语》 https://www.youtube.com/channel/UCllnEOKDN7hkh828rEZ3_dA 巴基斯坦：《巴铁小哥哥阿里》 https://www.youtube.com/channel/UCwCS6js8cWkolDt5EVpkFDw 美国：《莫彩曦Hailey》 https://www.youtube.com/channel/UCZqsvi6uhFrbsJcAmcZudcQ 日本：《Mako 老师》 https://www.youtube.com/channel/UC0KFHjN2RWTN5tUutY8eF3g 越南：《Hang TV - 越南夯台灣》 https://www.youtube.com/channel/UCGa2zm_0pi0P3oo5O75wKRQ 印尼：《一個會說中文的印尼人》 https://www.youtube.com/channel/UCvSeWiQ0uGMyC3k3xyFkctQ

t@technician 25 December 2020

Understanding different cultures through Youtube We know that the world media is controlled under some big shots/countries for their own benefit. E.g when we talked about Iran, layman could easily think of evil country or conservative people as what the main source media painted them and wants us to believe it also. Thanks to modern day social media, more and more layman of common people like us , can self portray their life and community to outside world. For example, recently I found this Iranian Youtuber whose channels are mainly conducted in Chinese language , and channel named after "Persian secret language" is very useful tool to understand Iran rather than the conventional newspaper ! https://www.youtube.com/watch?v=VNfuX2JNBnQ Some not so common topics also covered under this channel! eg there are quite a number of non-muslim - Armenian in Iran , and their lifestyle is so different ! really an eye-opening to me ! https://www.youtube.com/watch?v=P80yU-RyxkE Also She talked about the Kurd , which is definitely open many people eyes especially to the Chinese-speaking world. https://www.youtube.com/watch?v=cf9uxnnbEx4 More and more flat world, and more people sharing this type of clips , then the world tends to understand each other more and accepting the difference between us. Peace ! Thanks for all the content creators working on this area, more understanding , more peace

t@technician 25 December 2020

Mass Flow Control (MFC) In semicon indusctry , there is one sparepart that is very common in all department . That is Mass Flow Controller (MFC). Function of the MFC is receiving the command from the computer , and open up the micro valve inside it and let the gas to flow through it. Eg. if your process asks for 100 sccm Argon gas, then it will open up the valve and measure the difference of gas had gone through it. MFC of different gas need to be calibrated using different formula. So in fact , it can last for quite long eg 10 years for stable gases eg Argon and Nitrogen. And one for difference in MFC also could be the connector to it, most common will be the 9 pin type, but some also the card-edge as like below photo: Hope you find it useful in understanding semicon field further.

t@technician 9 December 2020

Learning more BCH via read.cash Just get to learn Bitcoin Cash after joining this platform, read.cash, so also able to generate few BCH and learn to crypto world more after getting few. The recent BCH hard fork I also missed out , so not getting any additional coin. But it sparks my interest to learn more about this coin that read.cash attached to. Friend sent me this video and asked to go through, but after go through also not much conclusion from it. Definitely need to dive into more videos and learning materials to make better sound decision in future. https://www.youtube.com/watch?v=JTkjZuz7h7I Is Bitcoin Cash or Bitcoin Trash ? I still have more to learn . Hopefully get to learn as much crypto knowledge here and propel us higher to the gain.

t@technician 8 December 2020

SCADA system- real time gas pressure monitoring In semicon industry, there is a system for the facility team to monitor real time the gas pressure in each and every gas manifold and gas cylinder that they supply to the modules. For instance, they supply Silane gas to certain machines, so the pressure will have to closely monitored by the SCADA system. If there is any abnormal thing happen, some action can be taken to prevent it from getting worse. Below the screen on the SCADA. If you want to zoom into any particular minute, you can do so by panning in. And this chart only worrying, up and down up and down with so much magnitude. This will definitely affecting the product quality is the pressure and flow is not stable. This is by all means need to be avoided.

t@technician 6 December 2020

5S housekeeping experience sharing Continue the last topic of 5S in the manufacturing line. Sometime really of one kind that, during startup , vendor or contractor never dispose away their stuff but left over like photo below, and went away. The you know your bad days come when 5S auditor take photo and send to the whole world and ask to clear within a week or so. Can you have a feeling how heavy is the box itself? and full load of many many different stuffs. After sweat and swear, still need to loan camera and take the after clear photo! tired !

t@technician 5 December 2020

5S in the manufacturing line If you in manufacturing line, you would have heard of 5S practice. Basically 5S stands for Sort, Set in Order, Shine, Standardize, & Sustain. The idea originate from Japan. And the original 5S refers to seiri (整理), seiton (整頓), seisō (清掃), seiketsu (清潔), and shitsuke (躾). But too hard for non-japanese to remember seiton etc, so there comes the English version. My line not escaped from this 5S practice but strictly follow, so when you are the technician or engineer assigned to certain area, and your area being inspected by this group of 5S people, then you better hope their eye blind a bit and not to highlight you much. They will come out with the whole list that they think not fulfilling 5S and ask you to clear by short period of time like below list Then they will force to have some 5S checking list after machine intervention. Ask technicians to adhere strictly . But never aware that 5 min is not enough to cover all things in the checklist, it would cost at least 20min to clear everything. Do you have similar practice in your company? can just share with me the info in comment column below.

t@technician 1 December 2020

Exhaust line leak causing bad smell Share another past history of exhaust line choke and causing leak. There was a feedback that the whole subfab was full of bad smell and after smell detector went through the whole subfab , was highly suspected the bad smell caused by this leak at the exhaust line. The joint was not screwed tighly or over years, the connection loosened, you can clearly see a layer of yellowish thing came out from the line. The choke line from another angle. Can see the powder overflow to outside the joint and accumulate at the heater jacket. Top view of the exhaust line, can clearly see whole thing was quite long and hardened become black and yellowish. example as below: the line is half-filled with powder, that's why suction is weak and overflow out and causing contamination, which is health hazard.

+1 more

t@technician 29 November 2020

Exhaust pressure real time monitoring So last articles already told audience you all that problem we always faces in the production line. So instead of lettting the problem pop up by itself and caught us off guard, we decided to monitor the exhaust pressure in real time and set in system to trigger us exhaust pressure is dropping and prompt us to do the cleaning. We buy this Omega pressure monitor . And the S1 S2 & S3 dip switch able to toggle the setting you wish to monitor, eg your pressure range is 0-7.5 IWC, or 0-15 or 0-30 iwc. So you have to set correct range to capture the most precise way. The feed-in data is connect to the 0 and negative, and the 24V positive and negative to be connected to + & - sign (red & black cable) So the overall setting is like below: the end plate connected with a tube, this tube go to the controller nearby and determine the suction pressure in the exhaust line. Then we set in the real time monitoring system whatever level we feel in time for us to arrange cleaning eg 5 days in advance.

t@technician 25 November 2020

Exhaust line corrosion A little additional info for the previous post- exhaust line cleaning. Due to overlook every exhaust line condition timely, this line was fully choke until contaminated out from the tube and corroded. As you can see from the picture below, the yellow by-product was fully choke out the line. The remaining 1/8 space is super dupe weak for by-product to pass through. The corroded line unable to reuse anymore, but to make another new one for replacement. All the tube material also corroded until peeled off. The aftermath line was installed back , the shining reminds others there is the newly fabricated line.

t@technician 23 November 2020

Small accident Today a small accident happened , luckily is not big problem. That is a raise floor cover was misaligned and flip. The root cause we found due to the small little hinge was broken! too unlucky to the injured personnel. Accidents do happened anywhere , not much we can do but to be careful ourselves all the time, be it as simple as walking , do not drag your attention like talking over phone or seeing the phone et.

t@technician 22 November 2020

Exhaust line cleaning Last post I talked about the exhaust line need to clean periodically, some can last longer some shorter, all depend on the exhaust pressure gauge reading. If it drop lower, then it will be time to arrange for the cleaning job. Today I will talk about the situation when you encountered the exhaust line choking. First scenario and most common will be like this, white powder with the center only without any powder and the left over suction is through the small hole. Sometime you also can see powder hardened became the rock pieces. Normally this is heavier as the incident should happened longer and accumulate longer. The third is a bit combinational. The surface became rough and super difficult to clean away even using metal rod.

t@technician 16 November 2020

Exhaust line choke During a routine walk down then found this exhaust line rainbow color. Rainbow means something choke there, maybe due to the line bented , so the powder accumulated there easily and next slowly leak through from there over time. So no choice, but to schedule to down the tool and arrange with cleaning vendor for 1 day to clean up the choke part especially. Tool will be down because the pump will stop pumping down the residue gases. While waiting for the scheduled clean, need to arrange paper work for necessary works to be done.

t@technician 15 November 2020

Gate valve to send out repair Second surprise of the day , nobody bother to send the faulty gate valve to repair! Gate valve functions as a separate valve to isolate whether to suck the gas through vacuum pump or shut off . So the mechanism is very simple, extend to shut the valve , or retract to let the vacuum pump to suck the foreline gases. So we always need to standby this part in case anyone spare down then can swop in. Stay tune for more machine stuff!

t@technician 15 November 2020

LAN point cover damaged Everything can happen when you deal with production 24/7 line. For example, today when the production manager feedback to us that one operator was hurt by a dislocated LAN point cover.. So unusual things did happen time to time, a decent LAN point cover also can step and clash and deformed. Then the involved operator get hurt and get MC. While our tool side, the LAN plug deformed and affected the machine connectivity and fault out. Ciela vie , that's life ... Unexpected things happens, we can just be careful always. Minimize the risk in work.

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