Today we found some abnormality , and after performed the check, result as this. Incoming lot found broken after opening box to align wafers by Operator. Incident witnessed by BL. Suspect both wafers already broken even before opening the box as OP slowly open the box and already learned from previous similar incidents. It is impossible to be broken during LM operation as wafers already been transferred to wacker box and silicon debris are all in the carrier and box.
Possible root cause of wafer breakage:
1.LM OP closed the wacker box forcefully.
2.Transporter see the box mildly open and close forcefully
3.Batching operator during wafer planning see the box mildly open and close forcefully
4.Batching operator open the box fast and 1 wafer stucked on wacker top cover groove and when put back broken. Aside from LM#15 and 16, LM#14 has high defect count due to scratches induced by LM15 onto its wafer surface.
23 wafers already completed EPI growth including LM14 w/scratches. Merge lot and hold under 240WH [SHOM] to investigate. Since G4 SHOM didn't HOLD wafers in WSO under G2 SHOM right away after find broken wafers, so G2 SHOM, re logged to G4 SHOM as owner.
ENG PROJECT/EXPERIMENTS:
Deployment effectiveness:
1. Pls audit the black box usage and compliance, there is observation that some
opers are still using etch scope for post bacthing inspection.
2. Pls feedback the FL conversion bay leaders give results after our deployment.
Next week we will continue and start:
1. Fixed dope excel deployment to BL
2. N+ / 2w / FL TR alignment
