Mid day report to boss
Batching feedback incoming seen 3 wfrs with haze #7/16/19, wfrs at 1F Tube. He feedback he split out the 3 wfrs from mum lot. Previous oper is Tube2- LMODE.
From scope, seen the 3pcs with stain like defect, under scope got crystal/oxide residue-like defect. Unable to confirm if can further re-process,ask engineer also unsure.
Lots Sent to rewash but no improvement. Confirmed other wafers w Epi, no stain seen. No recipe in AVi to scan for ink off. Raised req form to create rcp 2x but encounter some error when submit req. Pls help to bring the wfrs to AVI bay, lot at 1F Bay, or just manually ink off from elogbook if still cannot submit request,.
Inkoff in elogbook then passed lot to epi engr.fb he will sample grow to chk if stain will not get worse or cause other abnormality.
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Washing tool issue:
MS removed N2 nozzle and adj angle to potrude .Ss passed using Via rcp, no stain
But encounter resist residue: Defect decrease across slot, meaning slot 5 most
severe whereby slot25 lesser.
Current flow rate: T2:12LPM, T4: 10LPM. Requested MS to reduce flow rate for T2 to 8.5LPM.
Lot reviewed aft scrubber/gasonic counts reduced
Hit 2 lots with the same water stain mark issue. After re-SRD and rescan cleared. Tool down for MS to check.
MS adjust door & increase n2 purge, via ss 30000p, mid 7000, start. Re-edit Via rcp for step 26 dry step frm 1-> 8mins, total dry time 15min. K6: 14:35mins. Observed at step 26, chamber alr seen with stain but actually slightly better than before.
Supervisor inform MS to drain IPA tanks and run again the edited recipe.
