As monday morning, we need to update the status weekly report:
Metal 2 ALCU strip wet resist
Lots detected with bubble like defect at wafer edges during inspection (slot25,LM#04)-> at wafer right edges. #04 was scanned previously during Batching like AVI not capable of detecting this small bubble defect.
Slot25,LM#23)->at wafer edges. #23 was scanned previously during and passing with low count. Defect look like underlayer resist bubble/water stain happen during poly/contact layer. Shadowish contact rainbowish colour observed.
Concurrently, there is one lot failing AVI OOC at CONTACI (#11/12=~39/38 count) with similar bubble stain localised at wafer right or left affecting 1 dies. Please help to perform AVI 100% and send lot for rewash to see if stain can be removed.
Both lots released and advanced hold after Etch wet tantalum to perform 100% AVI scan to see if can detect.
Please help to tag current 6 lots from poly level to scan 100%.
100% scan LM08-19 seen with same defect at the LHS/RHS edge. Lots sent for rewash but no improvement seen. Lot still on-hold . <5 counts,no similar map all moved out.
Advance hold at Pad to check if similar defect as WMK lots -> done scan 100% but cannot see the bubble defect.maj ul particles and false cnts.move to monitor yld as inst
MAX DELAY TRIGERRING FRM BOE TO TMAH
- If max delay>15min, error msg Peed001 Max delay exceeded will prompt out.
- to perform sample rework. If sample ok, to KEY REWORK ROUTE for other wafers
- NO MANUAL REWORK ALLOWED. To re-read the specific task and acknowledge.
Additional eSTAR alarm activation for BOE process . Estar will be activated if:-
i) Operator did not attend tool within 1min aft lots finish process, lots will
auto hold
ii) Operator did not unload lots to tse within 1min, lots will auto hold
