Today is relatively good day, issues are controlleabe:
Lot prev hold for stain after EWITO strip resist,only saw the slight discoloration at the test pattern. Did not notice the suspected TIW lack at the edge dice. As checked by LSZ, got history of remask at mask ITO due to wrong dev pg used.
Took photos of mask pattern for ITO/TIW lvls,& confirmed the affected pattern is TIW.chk tools but no downtime seen, refer to excel. No buddy lot at 5EWB03,run @bathlife 16 lots/14 hrs.no buddy lot at S4 as well,lots before/after are jetmos via level.
Check maestria cannot find any abnormality when compared with other run. Nearest lot of same pdt still at EPI.to discuss with N3.
Another lot W3 on-hold at IQC due to suspect ITO lack, affected wafer edges/mostly on the flat area. Saw in WSO have history of inspection for bubbles aft dep pese 2. Lot not yet 100% assessed. Single lot ran in 7A.
Lot checked 100% .12 wafer affected. Laser mark 05/24/23/25/13/14/16/11 affected few dice at 1st row of flat. Laser mark 18/04/03/01 affected 2 row from flat and right and left side of wafer flat. Affected dice metal peel same for same pattern of dice.
Informed masking to check. W534KP3 relog to ic as the affected dice affected with tiw lifting. relog to ic to relog to correct owner.
