Brand new issue happened in machine , we term it metal thin.
history of the flow is so:
Lot load into MS02 by Sami, he went to washroom and informed piao ting to unload the lot when done etch. Due to miscommunication, she thought she was asked to take care of another bench, WB09. The lot was overetch for extra 7 minutes (Total 17munites) when she realized the MAS alarm.
Photo taken and compared with good wafer. Awaiting N3 to consult Device regarding the acceptable overetch factor. Informed etch sup, Eder to HIF the opr.
Awaitng monday to attend MRB before send lot for rework. After attended MRB, approved. Lot sent for freckle etch 520s, done & signed on runsheet. Lot adjusted backward to op 5931 for clean pre metal dep, Batch engr already checked steps on rework form. A/w MAS end bath to strip metal, freckle, to follow up
Avago 6" TiW Etch
Refer to email,find back TiW A & TiW B test wafer lots (5inch) in F2.Recycle 2lots to strip TiW (if haven't strip), Posistrip Clean (WB05), Sput TiW & Mask TiW (Follow Avago process step)
Not find at FD,TIW bay and engr racks already check- Checked all test wafers lot at F2 etch bays, N2 box & tables, only found 5pcs scribed with TiW B (#19,20,21,23,24), which sputtered with AlSi, measured all wfrs with 2um except #23 & #24 with 0.67um(used), wfrs placed at eng table with on hold slip.
2 lots find at T8,take back to strip TIW 2hours each at end of BL,at end of shift will strip done,to follow do inspection and posistrip clean,after posistrip clean to change chimical.If no residue seen,to sent to sput TIW/mask TIW(normal Avago process step).2 lot park at bay 1 table.
After posistrip clean, WB16 chg sol. Instruction form attached to sputter/ Mask TiW according to Avago prod process flow. Lot TiW A=24pcs, lot TiW B=18pcs.
Both lots done sputter TiW end of shift and passed to G2 bayleader Ewe, awaiting to proceed gasonic descum due to high WIP, to follow up status Collect data Lot set auto hold at 5068 etch ALSI move in and move out,this is the last lot which product from 5" change into 6",need to collect data before/after etch. To take some photos measure metal line and con hole at centre/edge 1 pc.
