Today have to continue to sweep the dust
Engineering work for problematic production lots:
XX40 OOS lot disposition need full lot measurement. Many of you may know XX40 OOS lot disposition need 100% measurement. If any lot encounter OOS for CD and thickness, pls sort wafers and do all 25 wafers measurement before move lot to next level.
We may have more OOS due to contact ROX bring down. I need team help to do 100% measurement if ROX after metal etch showed OOS. After re-measure, please send am email to Thomes. Pls adjust step to remeasure good wafer before move out the lot.
Pls hold at next step for PO to dispose the lot. (no max delay operation)
8" BCD6: Residue Issue at EM layer (LOT # START WITH "C"). AITX will hold the lot if residue counts>30 and etching will manual rework. If residue <50 counts, lot can move as per normal. If failed, pls rework lot with BKMPOLYMER in ETGP8xx. Latest info, don't hold back under 230 after rework, keep on hold 214RWK
PAM801/802 alarms that fail for black mapping at EM2 scan. As per PO, in future if will encounter the same issue (wafer stayed in chm for a long time) or any alarm and affected wafer failed for black mapping, ok to scrap immediately and inform her. If failed cluster of particles, adv hold for PO to dispose at EDIFH / EDPASS.
IF ENCOUNTER ANY HE BACKSIDE ISSUE PROBLEM DESCRIPTION NEED TO INCLUDING:
1. HOW MANY LOT IMPACTED
2. HOW MANY TOOL IMPACTED
3. HOW MANY WAFER IMPACTED
4. DEVELOPER STAIN ISSUE
AND NEED TO FEEDBACK TO PROD ENGR.
For 8V lots incoming for this prdt CL283AA6-6 (hold for PO), pls execute:-
- Sort to LM# before PROC
- Proc ONLY 1 lot in AAE06/4/7 no buddy lots allowed.
Procedure for AJTANA lot process in ASLM851: PLs season the chamber with QRENA recipe. Process the lots and delinked recipe after. Pls do 10 wafers std seasoning and SS check before run std
