Engineering issues that we faced last 2 days , Too many until the width of page may not enough to write:
1.) 8" BRE6: Residue Issue at EM layer (LOT # START WITH "C")
Do not rework any BCD lot for resist residue until further notice. If AIT
send for rework, pls inform PO or hold until morning. Refer to email sent by Kelvin regarding rework. AIT will hold the lot if residue counts>30 and etching will manual rework.
If resist residue <30 counts, lot can move as per normal. Device will automate rework route soon and future we will rework by WSO. Feedback if information is not clear.
2. MG40 OOS lot disposition need full lot measurement:
Many of you may know MG40 OOS lot disposition need 100% measurement. If any
lot encounter OOS for CD and thickness, pls sort wafers and do all 25 wafers
measurement before move lot to next level. We may have more OOS due to contact ROX bring down. I need team help to do 100% measurement if ROX after metal etch showed OOS.
As for OOC, no need to do 100% measurement. AFTER Remeasure , Please send email to Ehah. Pls adjust step to remeasure good wafer before move out the lot.
3.Miscellaneous:
18 inch wafer random scrap, please put details in WSO and SMY:
- which tool ID
- which wafer ID
- what happened
- process actions if have any
4. For R4 lots incoming for this prd HHYS(hold for PO), pls execute:-
- Sort to LM# before PROC
- Proc ONLY 1 lot in HYE4 no buddy lots allowed.
- Note: Loading Sequence: FR-SEQ
5. ARAM801 & ARAM802 POST PM RELEASE PROCEDURE
+++++++++++++++++++++++++++++++++++++++++++
a. Post PM only can run RSW lot only. Metal2 recipe to link >15 RF hours.
b. If there was no wip for RSW, pls do resist seasoning to reach RF counter
up to 15. (You can withdraw wafers from wfer maangement).
c. When tool is down for PM or maint team feed back for "open chamber" .
Pls delink metal 2 recipe.
If chamber B (PM/open chamber) delink PTR
If chamber C(PM/open chamber) delink ATR
