Some abnormality in tool Today we found some abnormality , and after performed the check, result as this. Incoming lot found broken after opening box to align wafers by Operator. Incident witnessed by BL. Suspect both wafers already broken even before opening the box as OP slowly open the box and already learned from previous similar incidents. It is impossible to be broken during LM operation as wafers already been transferred to wacker box and silicon debris are all in the…
@technician in September 2021
Mid day report Sep 2 **Mid day report to boss** Batching feedback incoming seen 3 wfrs with haze #7/16/19, wfrs at 1F Tube. He feedback he split out the 3 wfrs from mum lot. Previous oper is Tube2- LMODE. From scope, seen the 3pcs with stain like defect, under scope got crystal/oxide residue-like defect. Unable to confirm if can further re-process,ask engineer also unsure. Lots Sent to rewash but no improvement. Confirmed other wafers w Epi, no stain seen. No recipe in AVi…
Line chronic issues that need followup We have few chronic issues that need constant followup, and today I updated the status as below: **Under etch issue** Dry etch feedback whole lot seen with ITO ue. Inspected only 7 wfrs and as above seen with the circular signature around the edges of wfr with slot #14 most severe. Remaining wafers only seen with the whitish ring at the wfr RHS. Checked under scope, brown pad seen everywhere. Buddy run inspected good. Lot run before,…
Abnormal pattern on test wafers We need to urgent activated the line support for test wafers mixture. George prepared 7 wafers bare Si wafers placed beside PSE, which to send for standard SiN. Mask Via(any product - to take note of what pdt) Need to Etch Via (To etch using fix time; normally use endpoint. To ask dry spin what is the average etch time used for and add additional 20-30s. Ensure that it is etch to clear) Sputter std Ta/Au as per the pdt flow. Need to etch in…
Mid day report for new week As monday morning, we need to update the status weekly report: Metal 2 ALCU strip wet resist Lots detected with bubble like defect at wafer edges during inspection (slot25,LM#04)-> at wafer right edges. #04 was scanned previously during Batching like AVI not capable of detecting this small bubble defect. Slot25,LM#23)->at wafer edges. #23 was scanned previously during and passing with low count. Defect look like underlayer resist bubble/water…
No head no tail We came to some issue that unconclusive. Taping relog due to same defect as prev case, photo taken - Pattern distorted at dice edges. Peding investigation and pulled commonality. No common tool for wets side. Only common tool is Washing1. Verified the 2 lots, only 1 wfr each affected. Batching feedback another 2 lots similar defect, bth detected at Mask. All seen with straight line "stain" defect under macro view localised from 1oadlock to wafer center, 1 wfr…
Vacuum pump pressure not reach setpoint within time Vacuum pump pressure not reach setpoint within time Tool encounter vac pump pressure not reach setpoint within time. Checked all testwafers inline all have oxide. Measured oxide is ~10K. Good results come from the one sputerred at Tool 2 with 3.2um (ER=.89) and the one from prod ER tw BOX2 (ER=.88). The other 2 wafers, was oe on edges. Currently still have 1 wafer good ER tw left (Tool 2,3.2um). To use later for scheduled…
Machine Arm hang half way Machine Arm hang half way Feedback by operator Alifu, when he proc wafer initially, there was no abnormality, timing and recipe was correct, he returned when the alarm sound was heard, signalling the qdr process end but instead he saw the arm on top of chemical tank. Then lot on RHS (W3) of arm is inside the chem tank, Left hand side lot (W58) just hanging on the arm. he pressed stop process but the machine no response. He called maintenance & move…
Mid day issues **H2O2 spike error** We found cannot spike H2O2. Check H2O2 vessel, full level. Check and found main H2O2 solenoid spoilt. Replace solenoid with spare from 8th floor office, ok. Test spike H2O2 for all tanks, ok. Found qdr reclaim valve leak, replaced new valve. Also found solenoid cda tubing water inside. Check found h202 vessel N2 pressure valve leak. H202 leak to solenoid. Replaced the N2 pressure valve. Purge all tubing. Took out solenoid for clean. Fixed…
Production undercut issue Just when you think going to be a peaceful weekend, QC detected with suspect undercut. Inspected, whole lot affected with undercut on capacitor. Defect looks same for all 25pcs and is affecting the whole wafer. Etch capacitor done in WB11 @er:878 A/min. No machine down. No abnornal delay in WSO. Lot ran before: W2543 already terminated without hold. after: W15V24 also no hold. Mask capacitor have down time when running this lot in WW54 due to…
Problem never rest even on weekend One bad thing about production line over 24/7 is problem never rest even on weekend. We have these problems as example: Line issue over weekend: **N+ LIFTING** 2 lots seen with lifting at alignment pattern only. Inspected die seen with slightly higher undercut but no lifting. WB8B ER: 1494A/min within control. All wafers affected. Discussed with mask engineer Juce, already advance hold at incoming mask USG for them to try to align as he…
Weekend problems Sunday the issues still ok, not too many pop up. But still a few from them: **R&D UNDER ETCH** **WET SINKER** 3 rnd lots underetch (whole lot - whole wfr affected). Measured remaining thickness ~1200A highest. Diff flow from std productions. All 3 lots from BRC4 (all 3 lots batched) . temperature check on monitor at 32.2C, measured at 32.5C. Incoming thickness for 1st ox at 14833-14843A. No splits on template. ER for 8A: 1450A/min. Time on runsheet is 9m20s,…
Midday issue 13 Sep Start of week is monday blue. All issues are not easy issue. **HARDENED RESIST** 4 lots at bomba dirty. Hardened resist like previous lots. All with 4.4um blue resist. All from bathcing59, as per masking, only tool for blue resist. All lots wash in 2EWB23, tanks slightly dirty. Wafers seen with hardened resist. Lots rewashed in bench and changed chemical. Aft rewash, wafers clean, moved out. **AG PITTING** Two lots hold for residue. Inspected the lots but…
Metal Thin issue happened Brand new issue happened in machine , we term it metal thin. history of the flow is so: Lot load into MS02 by Sami, he went to washroom and informed piao ting to unload the lot when done etch. Due to miscommunication, she thought she was asked to take care of another bench, WB09. The lot was overetch for extra 7 minutes (Total 17munites) when she realized the MAS alarm. Photo taken and compared with good wafer. Awaiting N3 to consult Device…
Mid day report 16 September Not an easy day with problems in 3 areas, so we have to one by one settle. **STS1 MAESTRIA ALARM** MF:Min(Tank 2 Active(Conc Scaled)) alarm encountered for via run confirmed fluctuation in the maestria graph; already changed controller but still encountered alarms,changed valves and key to prod monitor no more alarms, to monitor all maestria data w/ in shift to check for spikes To extract the maestria data for all runs within shift at end of shift…
Problem appear everywhere When there is problem, we started to argue who is right who is wrong. Debate went on and on. **INCOMING BROKEN** Summary: operator Josh seen 1pc broken when opened box, LM19/slot22 when about to run bomba. broken 12-6 o’clock and seen chip on 12 o’clock with no acknowledge on r/s. Lot hold to production. dry etch also no clamp point and key out with no issue. M/l sent to bomba already haven’t inspected. Awaiting supervisor to agree to scrap.…
Evaluation for backside clean A little update on the project we follow this far: MEMS BACKSIDE CLEAN EVALUATE BACKGROUND: ENGINEER evaluate for backside clean, this wafer after dry etch sent to coat recipe front side, then do 1% HF 5min to clean backside. After HF clean will strip resist use SVC14, but now SVC14 still pending vendor, so as Aigen comment we sent to strip resist use batch540. now I done 1pc wafer(slot01) R-ST-RIN at batch540, but under scope can see some red…
Mid day report 20 Sep Today mid-day report are as below: Lifting Level: Etch Wet Active Summary: 1 lot seen with lifting after etch metal and suspect it is due to over etch at Etch Wet Active. We raised NCL and moved the lot Lot on hold to do 100% T-84 testing due to NCL lot. 100% .T4 testing done and passed, moved to monitor yield. Unfortunatly, LM23 RES_MET_THIN value has difference compared to other LM. Batching TS2 Hold Proc Summary: Operator Ying Ing fdback STS2 running…
Weekend mid-day report: Today have to work from home during weekend for mid-day report: **R765 –** B side RS DW OOC due to B-point low and T-point high on cavity #07. However previous run RS DW on cav#07 is within control. Suspect due to tapping issue or measurement error So have to arrange to measure same wafer and other cavity for further check. Next run arrange to measure RS profile. RS DW-11.47% VS SPEC=15.2%. To continue production, however next run still RS DW…
Report for the day 27 Sep Today considered relatively good day for a start of the week: R919 Inform maintenance to ensure external data logger is working before carry out test run . Every run to measue RS as instructed. B side 2W TR Res Ave=68.7 (4.3ohm higher) compared to previous run with same dope setting of 29.8cc Res Ave=64.4ohm (OK) while A side Res Ave=64.9ohm (OK) External data logger for both TR shows Dope flow extension on 1st Layer. This means that issue is…