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I work as technician in a Singapore semiconductor factory. Here I share my working life as technician.
The process involves the metal deposition onto the wafers, it's just matter of what target material to be deposited subject to the process need.
This I am going to show is Aluminium Copper (AlCu).
As you can see, the surface of the clamp ring is popping up like going to peeled out.
While the bottom side already have portion that already come out.
Closer look at the peeling off area:
Nothing much can be done, except change out all parts, clean up all area, and make sure root cause identified and move forward for tool recovery .
That's bit scary to see :p