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Today have to work from home during weekend for mid-day report:
B side RS DW OOC due to B-point low and T-point high on cavity #07. However previous run RS DW on cav#07 is within control. Suspect due to tapping issue or measurement error
So have to arrange to measure same wafer and other cavity for further check. Next run arrange to measure RS profile. RS DW-11.47% VS SPEC=15.2%. To continue production, however next run still RS DW OOC-16.78%
Next to perform treatment with bake and arranged next run wait for result. B side Res DW OOC after susceptor treatment. Recovered after change profile from 2,6-16 to 2,6-0 while A side profile changed from 1,3-8 to 1,4-8.
A side RS DR improved but DW OOC after change profiler coil . Current convert to 6B
Conversion from H42 to F49. Both side GR high : A side 1.14 & B side 1.17
Temp check A side 1096 vs 1100 degree C ; Temp check B side 1098 vs 1100 degree C
Suggest down for maintenance to check TC/BUBBLE/H2 carrier and so on . Current maintenance attending R8B S/F issue
Due to urgency on F49 Automotive, to change Sx from 17 to 14 and continue production. GR ~ 1.02um/min. Every run to measure thickness 1pcs, compare GR based on Center point and publish result per shift.
As per N3 team request to adjust H2 carrier pressure to original 1.5bar. Test run bypass HCL
After Replaced V22(SX pneumatic valve to bell. Arranged 1x1074 test run GR still low-1.29 um/min . Escalated result to N3 team